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CALL FOR PAPERS

Submission Deadline: Friday, February 8, 2019

The 20th annual IEEE Wireless and Microwave Technology Conference (WAMICON 2019) will be held in Cocoa Beach, Florida on April 8th and 9th 2019. The conference will address up-to-date multidisciplinary research needs and interdisciplinary aspects of wireless and RF technology. The program includes both oral and poster presentations as well as tutorials and special sessions. Prospective authors are invited to submit original and high-quality work for presentation at WAMICON 2019 and publication in IEEE Xplore. Conference website is www.wamicon.org. WAMICON welcomes and encourages strong participation from industry, academic and governmental groups interested in advancing wireless and microwave technology.

TOPICS OF INTEREST INCLUDE

The central theme of WAMICON2019 will be "Simulation Driven Design of Emerging Wireless, Microwave and mm-Wave Circuits and Systems." Submissions on all aspects of related technologies, including antennas, passive and active circuits, communication theory, and system concepts, are encouraged.

mm-Wave to THz Technologies

5G Communications, Backhaul, MIMO and Massive MIMO, Beamforming, Vehicle-to-Everything (V2x), SatCom, Human Body Scanners, Radar, Home/Office Application, Electronic Warfare (EW), Tactical Networks/Data Links, Packaging, Integrated Circuits

Internet of Things (IoT)

Smart Homes, Smart Cities, Machine-to-Machine (M2M), Bluetooth Low Energy (BLE), Light Fidelity (Li-Fi), Near-Field Communication (NFC), RFID, Zigbee, Low-Power Wide-Area Network (LPWAN), Active Denial, Cognitive Radios and Software Defined Radios

Power Amplifiers, Other Active Components, and Systems

High-Efficiency PAs, Linearization and Efficiency Enhancement Techniques, Novel PA Architectures, High-Power Devices, Linear/Nonlinear Device Modeling, Reliability/Thermal Considerations, Transceiver Design, Multi-Band and Digital RF Circuits and Systems, System-On-Chip, System-In-Package, Radar RF/MMIC Electronics, Active Filters

Passive Components and Antennas

Filters, Transmission Line Components, MEMS, Advanced Packaging, Antennas and Arrays, Meta-Materials, Frequency Selective Surfaces, Non-Foster Impedance Matching

Microwave Applications

Biomedical Applications, Wireless Sensing, Energy Harvesting, Wireless Power Transfer, Radar, Additive Manufacturing, RF Applications in Space Exploration, Aerospace Applications of RF Circuits and Systems

PAPER SUBMISSION INSTRUCTIONS

Authors are asked to submit papers electronically in .PDF format. In order to be considered for publication by the Technical Program Committee, a submission of 3-4 pages, clearly describing the concept and results must be submitted before the deadline of February 8, 2019. Submissions will be evaluated for originality, significance of the work, technical soundness, and interest to a wide audience. Papers can be submitted using this link:

Paper Format

For your submission you can use the standard IEEE conference templates for Microsoft Word or LaTeX formats found at:

http://www.ieee.org/conferences_events/conferences/publishing/templates.html

Or directly using the links below:

MS Word Template:

http://www.ieee.org/publications_standards/publications/conferences/ieee-msw-usltr-template.zip

LaTeX Template: http://www.ieee.org/documents/ieee-latex-conference-template.zip

Papers must be submitted in Portable Document Format (PDF) format that can be generated using IEEE PDF eXpress (http://www.pdf-express.org/).

IEEE POLICIES

"IEEE reserves the right to exclude a paper from distribution after the conference (e.g., by not including it in IEEE Xplore) if the paper is not presented at the conference."

Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and IEEE will take action against any author who has engaged in either practice.

FPO